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THERMAL ANALYSIS AND FLOW VISUALIZATION OF A FLAT LOOP HEAT PIPE

Md Monir Hossain, John P. Kizito
Frontiers in Heat Pipes (FHP) 7 - 5 (2016)


Abstract


Thermal management is an important issue for electronic cooling application.  Choosing an efficient cooling technique depends on thermal performance, reliability, manufacturing cost, and prospects for minimization of packaging cost.  A loop heat pipe with a flat evaporator and a flat gap condenser was designed and developed to evaluate the loop performance for a range of heat load. During the study, the startup process and temperature profiles at different components of loop were compared at various heat loads. Heat transfer coefficients and the thermal resistances of the loop were also measured at these loads. In the evaporator, a disc shape copper wick was able to handle 100-watt heat load with the evaporator thermal resistance of 0.14 degree C/W and heat transfer coefficient of 14.1 W/(sq meter degree C). To visually investigate startup process and component performance, main structure of LHP was fabricated inside acrylic plastic block. The visualization process helps us to capture and understand the physical phenomenon of the loop in a single frame.


Full Text: PDF
DOI: http://dx.doi.org/10.5098/fhp.7.5

ISSN: 2155-658X