Electrical and chemical compatibility requirements of electronic components pose significant constraints on the choice of liquid coolants. Dielectric coolants such as Novec fluids and fluoroinerts are plagued by poor thermal properties. This necessitates the development of new heat transfer fluids. In this study we examine mixture formulations that provide an avenue for enhancing the properties of existing heat transfer fluids. Mixture formulations of Novec fluid (HFE 7200) with Methanol and Ethoxybutane are considered. Pool boiling experiments are performed on a copper nanowire surface. The results show an improvement of 24% and 11% in the CHF of HFE 7200 – Methanol and HFE 7200 - Ethoxybutane mixtures respectively, when compared to pure HFE 7200 at saturation condition. The mixtures also showed an enhancement in the CHF at subcooled conditions.