The field synergy principle and thermal resistance analysis were carried out for the heat transfer enhancement of a chip heat sink. Thermal analysis of the heat dissipation capacity is applied for setting up the gallery on the rib, changing the fan ventilation diameter, and changing the rib height. The results show that the analysis of field synergy principle agrees well with that of the thermal analysis, and setting up a gallery on the rib can improve the heat capacity of the heat sink. Meanwhile, the results also show that decreasing diameter of the ventilation causes heat capacity dropping because the reverse flow area increases and the air flow rate reduces. Furthermore, the rib height plays an important role in the flow path geometry, and it has a significant effect on the convective heat transfer coefficient.