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Conduction is heat transfer across a stationary medium, either solid or fluid. For an electrically nonconducting solid, conduction is attributed to atomic activity in the form of lattice vibration, while the mechanism of conduction in an electrically-conducting solid is a combination of lattice vibration and translational motion of electrons. Heat conduction in a liquid or gas is due to the random motion and interaction of the molecules. For most engineering problems, it is impractical and unnecessary to track the motion of individual molecules and electrons, which may instead be described using the macroscopic averaged temperature.
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*<B>[[Basics of heat conduction|Basics]] </B>
 
*<B>[[Steady state heat conduction|Steady State Heat Conduction]]</B>
:[[One-dimensional steady-state heat conduction|One-dimensional heat conduction]], [[Steady-state heat conduction in plane and radial walls|plane and radial walls]], [[Heat conduction in extended surface|extended surface]], [[bioheat equation]], [[Steady-state two-dimensional conduction|two-dimensional heat conduction]], and [[heat conduction from buried object|conduction from buried object]].

*<B>[[Unsteady state heat conduction|Unsteady State Heat Conduction]]</B>
:[[Lumped analysis]], [[one-dimensional transient heat conduction in finite slab|finite slabs]], [[One-dimensional transient heat conduction in cylinder|cylinders]], [[One-dimensional transient heat conduction in sphere|spheres]], [[One-dimensional transient heat conduction in semi-infinite body|semi-infinite body]], and [[Multidimensional transient heat conduction|multidimensional conduction]]. 

*<B>[[Numerical Solution of Heat Conduction]]</b>
:[[Discretization]] of computational domain and governing equations, one-dimensional [[Numerical Solution of 1-D Steady Conduction|steady]] and [[Numerical Solution of 1-D Unsteady Conduction|unsteady]] state conduction, [[numerical solution of multi-dimensional unsteady-state conduction|multi-dimensional unsteady-state conduction]], and [[solution of algebraic equations]]

*<b>[[Melting and Solidification|Melting and Solidification]]</b>
:[[Classification of Melting and Solidification|Classifications]], [[Boundary Conditions at Solid-Liquid Interface|boundary conditions at interface]],[[Exact Solutions of Melting and Solidification Problems|exact solutions]], [[Integral Approximate Solution of Melting and Solidification Problems|integral approximate solution]], [[Numerical Simulation of Melting and Solidification|numerical solution]], [[Solidification of a binary solution system|binary system]], and [[Melting and Solidification in Porous Media|melting and solidification in porous media]]. 

*<b>[[Microscale heat conduction|Microscale Heat Conduction]]</b>
:[[Hyperbolic model]], [[Dual-Phase Lag (DPL) model]], [[two-temperature models]], and [[ultrafast melting and solidification]].

*<b>[[Related topics in heat conduction|Related Topics]]</b>


Back to [[Heat and Mass Transfer]].<br>
Back to [[Main Page|'''T'''hermal-'''F'''luids'''P'''edia Main Page]].

==References==

Faghri, A., Zhang, Y., and Howell, J. R., 2010, ''Advanced Heat and Mass Transfer'', Global Digital Press, Columbia, MO. 

==Further Reading==

==External Links==

Return to Heat conduction.

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