Global Digital Central Logo Frontiers in Heat Pipes (FHP)

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Randeep Singh, Masataka Mochizuki, Thang Nguyen, Aliakbar Akbarzadeh
Frontiers in Heat Pipes (FHP) 2 - 033003 (2011)


Heat pipes are invariably employed as heat transfer devices due to their high thermal conductance. Research is being conducted in RMIT to expand and develop the potential of the heat pipes as heat transfer devices for cooling high heat flux electronic chipsets and for heat extraction from low grade heat sources. Thermal management of electronic devices is becoming increasing challenging task due to the high heat flux associated with the microprocessors and limited available space for the integration of the thermal control device inside the cabinet. RMIT University, in collaboration with Fujikura Ltd. Japan, is involved in research and development on highly efficient heat transfer devices for electronic cooling. Different variants of the thermal solutions based on the passively pumped miniature Loop Heat Pipes (mLHPs) have been developed in RMIT. Total thermal resistance of these mLHPs is between 1 to 5 ºC/W. RMIT has also developed a Thermosyphon-Thermoelectric Module (TTM) that utilises low grade heat from the source in conjugation with thermo electric effect to produce electricity. The TTM relies on the wickless heat pipes (or thermosyphon) for heat extraction from the low grade heat source (e.g. geothermal or solar ponds) and thermoelectric generators (TEGs) to produce electric power from the extracted heat. The present paper outlines the state of technology developed by RMIT in the above mentioned fields.

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ISSN: 2155-658X