Browse Author Index

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Mei, Renwei, University of Florida
Melnyk, R. S., National Technical University of Ukraine
Mescher, A.M., University of Washington, Seattle
Mescher, Ann, University of Washington
Miao, Zheng, School of Energy and Power Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, 710049
Michel, Bruno, Advanced Thermal Packaging, IBM Zurich Research Laboratory, 8803 Rueschlikon
Miliauskas, Gintautas, Kaunas University of Technology
Mirabedin, Seyed Milad, Sharif University of Technology
Mirmanto, M., Mataram University
Mirzaie, Maryam, Vali-E-Asr University of Rafsanjan
Mistry, Karan H, Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge
Mitayani, A., National Research and Innovation Agency
Mochizuki, Masataka, The Heat Pipes
Mochizuki, Masataka, The Heat Pipe
Mochizuki, Masataka, Fujikura Ltd.
Modak, Sanat, University of Michigan-Ann Arbor
Mohammad, Saddam Atteyia, University of Mosul
Mohammed, Kafel Azeez, University of Anbar
Mohammed, Karam Hashim, Northern Technical University
Mohan, C.G., VIT University Vellore
Mohd Amir, Fithry, Universiti Tenaga Nasional
Mohd Kasim, Abdul Rahman, Universiti Malaysia Pahang
Mohiddin, S. Gouse, Madanapalle Institute of Technology & Science
Moinuddin, Khalid, Victoria University
Moitsheki, Raseelo J., Standard Bank of South Africa

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ISSN: 2151-8629