Open Access
ARTICLE
STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON THE COOLING OF ELECTRONIC COMPONENTS
Shankar Durgam
College of Engineering Pune, Maharashtra, 445001, India
* Corresponding author. Email: sodiitm@gmail.com
Frontiers in Heat and Mass Transfer 2022, 18, 1-10. https://doi.org/10.5098/hmt.18.49
Abstract
This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel
for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat
sources at uniform heat fluxes of 1000, 2000, and 3000 W/m
2
at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental
results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures
obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that
FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m
2
. However, the temperature variation between single and
multilayer CCB is 3 to 4 ◦C. The temperature reduction using CCB is 10 ◦C compared to FR4 and bakelite.
Keywords
Cite This Article
Durgam, S. (2022). STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON THE COOLING OF ELECTRONIC COMPONENTS.
Frontiers in Heat and Mass Transfer, 18(1), 1–10.